Air Cooling Technology for Electronic Equipment
Sung Jin Kim
260 pages, Hardcover
ISBN: 0849394473
ISBN13:
Language: English
Publish: June 30, 1996
Answers questions frequently asked by thermal and packaging engineers. Providing problem-solving analyses, this title covers theoretical, numerical, and experimental analyses, includes descriptions of 12 air cooling enhancement techniques, and discusses the limiting roles of heat transfer, fluid flow, and thermal coupling in electronic enclosures.